DLPC200_17 Datasheet, PDF (3/52 Pages) Texas Instruments – DLP Digital Controller for the DLP5500 DMD

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DLPC200
DLPS014E – APRIL 2010 – REVISED AUGUST 2014
Revision History (continued)
• Added Note about LED enabling after initilization is complete............................................................................................. 44
• Added Heat Sink section ...................................................................................................................................................... 46
Changes from Revision C (February 2012) to Revision D
Page
• Changed the ADV time line in Figure 6................................................................................................................................ 28
Changes from Revision B (December 2010) to Revision C
Page
• Changed typo on pin number for PORT1_D10 Pin ................................................................................................................ 6
• Changed typo on pin number for USB_CLK Pin .................................................................................................................... 8
• Changed I/O type to B₂ for USB interface data bus Pins ....................................................................................................... 8
• Added pin number A15 to PINFUNCTIONS table.................................................................................................................. 8
• Changed I/O type to B₂ for Flash/SRAM data Pins .............................................................................................................. 11
• Corrected the I/O type to O₃ on CFG_CSO terminal pin...................................................................................................... 16
• Added pin number AB17, U7, U8, and AD15 to Pin Functions table ................................................................................... 17
• Changed location of Absolute Maximum Ratings and Recommended Operating Conditions Tables in document............. 20
• Changed MIN and MAX T_J values in Recommended Operating Conditions ....................................................................... 20
• Added V_CC33 and V_{REF_B2-4} pins to Recommended Operating Conditions ............................................................................ 20
• Changed Input Port Interface figure ..................................................................................................................................... 22
• Changed SPI Slave Interface Timing Requirements table ................................................................................................... 27
• Added SPI Timing diagram................................................................................................................................................... 27
• Changed RSTsignal timing in Parallel Flash Write Timing diagram..................................................................................... 29
• Changed signal notations in Serial Flash Interface Timing Requirements table.................................................................. 30
• Changed signal notations in Flash Memory Interface Timing diagram ................................................................................ 30
• Changed signal notations in DLPA200 I/F Timing diagram.................................................................................................. 32
• Changed Typical Application diagram .................................................................................................................................. 38
• Changed paragraph about read mode in Parallel Flash Memory Interface ......................................................................... 40
• Deleted SRAM Interface Timing diagram and provided reference to the OEM data sheet ................................................. 41
• Replaced "DAD" with "DLPA200" ......................................................................................................................................... 42
• Changed location of Device Marking in document ............................................................................................................... 47
Changes from Revision A (May 2010) to Revision B
Page
• Changed typo on pin number for MEM_D43 Pin ................................................................................................................. 14
• Changed typo on pin number for MEM_D62 Pin ................................................................................................................. 14
• Added part number used for EEPROM ................................................................................................................................ 40
• Changed part number for Winbond part............................................................................................................................... 41
• Added new section for Power-Down Requirements ............................................................................................................. 44
Changes from Original (April 2010) to Revision A
Page
• Added / changed pin names, updated descriptions in Pin Functions table ........................................................................... 6
• Changed junction temperature and notated need for heat sink ........................................................................................... 20
• Deleted unused types, updated values in I/O Characteristics table..................................................................................... 21
• Changed parameter names to match figure......................................................................................................................... 34
• Added new section for Power-Up Requirements ................................................................................................................. 44
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