CD74HCT4067-Q1 Datasheet, PDF (3/14 Pages) Texas Instruments – HIGH-SPEED CMOS LOGIC 16-CHANNEL ANALOG MULTIPLEXER and DEMULTIPLEXER

CD74HCT4067-Q1
www.ti.com
SCLS601B – DECEMBER 2004 – REVISED AUGUST 2012
3.1 ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
I_IK
I_OK
I_O
I_O
T_J
T_stg
ESD
Rating
Supply voltage range⁽²⁾
Input clamp current (V_I < −0.5 V or V_I > V_CC + 0.5 V)
Output clamp current (V_O < −0.5 V or V_O > V_CC + 0.5 V)
Switch current (V_O > −0.5 V or V_O < V_CC + 0.5 V)
Output source or sink current per output pin (V_O > −0.5 V or V_O < V_CC + 0.5 V)
Continuous current through V_CC or GND
Maximum junction temperature
Storage temperature range
Human Body Model (HBM) AEC-Q100 classification level H1A
Charged Device Model (CDM) AEC-Q100 classification level C2
Latch-up per JESD78D
VALUE
MIN
−0.5
−65
Class 1
MAX
7
±20
±20
±25
±25
±50
150
150
400
250
UNIT
V
mA
mA
mA
mA
mA
°C
°C
V
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are referenced to GND, unless otherwise specified.
3.2 THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
CD74HCT4067-Q1
DW (24 PINS)
62.3
30.5
31.8
7.7
31.5
N/A
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
3.3 RECOMMENDED OPERATING CONDITIONS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
V_CC Supply voltage
V_IH High-level input voltage
V_IL Low-level input voltage
V_I
Input voltage
V_O
Output voltage
t_t
Input transition (rise and fall) time
T_A
Operating free-air temperature
V_CC = 4.5 V
4.5
5.5
V
2
V
0.8
V
0
V_CC
V
0
V_CC
V
0
500
ns
–40
125
°C
(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2004–2012, Texas Instruments Incorporated
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