ADC121S655 Datasheet, PDF (3/31 Pages) National Semiconductor (TI) – 12-Bit, 200 kSPS to 500 kSPS, Differential Input, Micro Power A/D Converter

ADC121S655
www.ti.com
SNAS402A – MAY 2007 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
Analog Supply Voltage V_A
Voltage on Any Pin to GND
Input Current at Any Pin⁽⁴⁾
Package Input Current ⁽⁴⁾
Power Consumption at T_A = 25°C
ESD Susceptibility⁽⁶⁾
Junction Temperature
Storage Temperature
Human Body Model
Machine Model
Charge Device Model
−0.3V to 6.5V
−0.3V to (V_A +0.3V)
±10 mA
±50 mA
See ⁽⁵⁾
2500V
250V
750V
+150°C
−65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, V_IN < GND or V_IN > V_A), the current at that pin should be limited
to 10 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to five.
(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax − T_A)/θ_JA. The values for maximum power dissipation listed above will be reached only when the ADC121S655 is
operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply
polarity is reversed). Such conditions should always be avoided.
(6) Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is a 220 pF capacitor discharged
through 0 Ω. Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an
automated assembler) then rapidly being discharged.
Operating Ratings⁽¹⁾⁽²⁾
Operating Temperature Range
Supply Voltage, V_A
Reference Voltage, V_REF
Input Common-Mode Voltage, V_CM
Digital Input Pins Voltage Range
Clock Frequency
−40°C ≤ T_A ≤ +105°C
+4.5V to +5.5V
1.0V to V_A
See Figure 59
0 to V_A
3.2 MHz to 8 MHz
Differential Analog Input Voltage
−V_REF to +V_REF
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance
Package
θ_JA
8-lead VSSOP
200°C / W
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging⁽¹⁾
(1) Reflow temperature profiles are different for lead-free packages.
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