THS6062IDR Datasheet, PDF (26/36 Pages) Texas Instruments – LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER

THS6062
SLOS228D – JANUARY 1999 – REVISED OCTOBER 2007
www.ti.com
dissipation. But the device should always be soldered to a copper plane to fully use the heat dissipation
properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted on
the PCB. As more trace and copper area is placed around the device, θ_JA decreases and the heat dissipation
capability increases. The currents and voltages shown in these graphs are for the total package. Because the
THS6062 is a dual amplifier, the sum of the RMS output currents and voltages should be used to choose the
proper package.
200
Package With
180
θ_JA ≤ 60°C/W
160
Maximum Output
Current Limit Line
1000
V_CC = ± 15 V
T_J = 150°C
T_A = 50°C
Both Channels
Maximum Output
Current Limit Line
140
100
120
100
80
60
40
20
0
0
SO-8 Package
θ_JA = 167°C/W
Low-K Test PCB
Safe Operating Area
SO-8 Package
θ_JA = 98°C/W
High-K Test PCB
V_CC = ± 5 V
T_J = 150°C
T_A = 50°C
Both Channels
1
2
3
4
5
| V_O | − RMS Output Voltage − V
Figure 50.
SO-8 Package
10
θ_JA = 98°C/W
High-K Test PCB
DGN Package
θ_JA = 58.4°C/W
SO-8 Package
θ_JA = 167°C/W
Safe Operating Area ^{Low-K Test PCB}
1
0
3
6
9
12
15
| V_O | − RMS Output Voltage − V
Figure 51.
EVALUATION BOARD
An evaluation board is available for the THS6062 (SLOP221). This board has been configured for very low
parasitic capacitance in order to realize the full performance of the amplifier. For more information, refer to the
THS6062 EVM User's Guide (SLOU036) To order the evaluation board contact your local TI sales office or
distributor.
26
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