LP2953QML_16 Datasheet, PDF (23/26 Pages) Texas Instruments – Adjustable Micropower Low-Dropout Voltage Regulators

PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2016
PACKAGING INFORMATION
Orderable Device
5962-9233602QXA
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
CFP
NAC 16
42
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-55 to 125
5962-9233602VXA
ACTIVE
CFP
NAC 16
42
TBD
Call TI
Call TI
-55 to 125
LP2953 MDS
LP2953AMGW-QMLV
ACTIVE DIESALE
ACTIVE
CFP
Y
0
NAC 16
34 Green (RoHS
& no Sb/Br)
42
TBD
Call TI
Call TI
Level-1-NA-UNLIM
Call TI
-55 to 125
-55 to 125
LP2953AMGW/883
ACTIVE
CFP
NAC 16
42
TBD
Call TI
Call TI
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
LP2953AMGW
/883 Q
5962-92336
02QXA ACO
02QXA >T
LP2953AMGW-
QMLV Q
5962-92336
02VXA ACO
02VXA >T
LP2953AMGW-
QMLV Q
5962-92336
02VXA ACO
02VXA >T
LP2953AMGW
/883 Q
5962-92336
02QXA ACO
02QXA >T
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Samples
Addendum-Page 1