EMB1433Q Datasheet, PDF (22/37 Pages) Texas Instruments – 60V 14-Channel Battery Stack Protection Chip

EMB1433Q
SNVS786B – JANUARY 2012 – REVISED NOVEMBER 2014
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7.4.1.3 EMB1433Q In Stack Topology
In a typical BMS application several cells in series need to be monitored. In order to accomplish this task several
EMB1433Q modules can be stacked with a minimal BOM of external components. Since each EMB1433Q
module in not provided with an address, the microcontroller connected to the first module at the bottom of the
stack needs to know the exact number of modules present in the stack. The top module of the stack need to be
marked as top module applying a high logic level voltage to TOP_MOD_ID. All the other modules of the stack will
have TOP_MOD_ID connected at low logic level voltage. All the analog and digital supplies voltage are locally
referred, a LDO for each EMB1433Q module could provide the required local voltage supplies.
7.4.1.4 EMB1433Q-to-EMB1433Q Interface
In a stack topology with more than one EMB1433Q no external component is necessary to level shift the ping
bidirectional signal. Only for reliability issues (in case of 2 adjacent battery modules getting disconnected
because of a broken cable), it is advisable to insert 500V HV diodes in the channel. Moreover in order to avoid
the damage of the EMB1433Q in hot plug condition, current limit resistors need to be add in series to the HV
diodes. A complete schematic with all required passive components is showed in Figure 22.
Component
R
DS
DZ
D
ESD
Description
Current limit resistance
High Voltage Schottky Diode
Transient voltage suppressor
Current regulative diode
Bidirectional transient voltage suppressor
Suggested value
50Ω
V_F=0.7V, V_R=100V, I_O=1A
Clamping Voltage = 5V, I_R=5A
Current limit = 2mA
Clamping Voltage =±5V
22
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