TLC5902_05 Datasheet, PDF (21/23 Pages) Texas Instruments – LED DRIVER

PZP (S-PQFP-G100)
0,50
75
76
TLC5902
LED DRIVER
SLLS382 – DECEMBER 1999
MECHANICAL DATA
PowerPAD™ PLASTIC QUAD FLATPACK
0,27
0,17
51
0,08 M
50
Thermal Pad
(see Note D)
100
26
0,13 NOM
1
1,05
0,95
25
12,00 TYP
14,20
13,80 ^SQ
16,20
15,80 ^SQ
0,25
0,15
0,05
0,75
0,45
Seating Plane
Gage Plane
0°– 7°
1,20 MAX
0,08
4146929/A 04/99
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimensions of the thermal
pad are 2 mm × 2 mm (maximum). The pad is centered on the bottom of the package.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments Incorporated.
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