TLC5902_05 Datasheet, PDF (16/23 Pages) Texas Instruments – LED DRIVER

TLC5902
LED DRIVER
SLLS382 – DECEMBER 1999
PRINCIPLES OF OPERATION
noise reduction (continued)
power supply
VCCLOG, VCCANA, and PVCC are supplied by a single power supply to minimize voltage differences between
these terminals.
The bypass capacitor is located between power supply and GND to eliminate the variation of power supply
voltage.
GND
Although GNDLOG, GNDANA, and GNDLED are internally tied together, these terminals should be externally
connected to reduce noise influence.
heat sink pad
The heat sink pad should be connected to GND to eliminate the noise influence since it is connected to the
bottom side of the IC chip. Also, the desired thermal effect is obtained by connecting this pad to the PCB pattern
with better thermal conductivity.
4.7
3.2
2.4
1.48
0
0
–20
25
85
TA – Free-Air Temperature – °C
NOTES: A. IC is mounted on PCB. PCB size: 102 × 76 × 1.6 [mm3], four layers with internal two layer having plane. The thermal pad is soldered
to PCB pattern of 10 mm2. For operation above 25°C free-air temperature, derate linearly at the rate of 38.2 mW/°C.
VCCLOG = VCCANA = PVCC = 5 V, IOL(C) = 80 mA, ICC is typical value
B. Consider thermal characteristics when selecting the material for the PCB, since the temperature will rise around the thermal pad.
Figure 3. Power Rating
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