TLC082-Q1 Datasheet, PDF (21/31 Pages) Texas Instruments – WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE-SUPPLY OPERATIONAL AMPLIFIERS

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TLC080-Q1, TLC081-Q1
TLC082-Q1, TLC083-Q1
TLC084-Q1, TLC085-Q1
SLOS510B – SEPTEMBER 2006 – REVISED MAY 2011
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
7
PWP Package
Low-K Test PCB
T_J = 150°C
6
θ_JA = 29.7°C/W
SOT-23 Package
5
DGN Package
Low-K Test PCB
θ_JA = 324°C/W
Low-K Test PCB
4 ^{θJA = 52.3°C/W}
SOIC Package
Low-K Test PCB
3 _{PDIP Package}
θ_JA = 176°C/W
Low-K Test PCB
2 ^{θJA = 104°C/W}
1
0
−55 −40 −25 −10 5 20 35 50 65 80 95 110 125
T_A − Free-Air Temperature − °C
A. Results are with no airflow and using JEDEC Standard Low-K test PCB.
Figure 55. Maximum Power Dissipation vs Free-Air Temperature
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the device,
especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most of the heat
dissipation is at low output voltages with high output currents.
The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The
PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a
copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other
hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the
device, θ_JA decreases and the heat dissipation capability increases. The currents and voltages shown in Typical
Characteristics are for the total package. For the dual or quad amplifier packages, the sum of the RMS output
currents and voltages should be used to choose the proper package.
Macromodel Information
Macromodel information provided was derived using Microsim Parts™, the model generation software used with
Microsim PSpice™. The Boyle macromodel⁽¹⁾ and subcircuit in Figure 56 are generated using the TLC08x typical
electrical and operating characteristics at T_A = 25°C. Using this information, output simulations of the following
key parameters can be generated to a tolerance of 20% (in most cases):
(1) G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, "Macromodeling of Integrated Circuit Operational Amplifiers,"
IEEE Journal of Solid-State Circuits, SC-9, 353 (1974).
• Maximum positive output voltage swing
• Maximum negative output voltage swing
• Slew rate
• Quiescent power dissipation
• Input bias current
• Open-loop voltage amplification
• Unity-gain frequency
• Common-mode rejection ratio
• Phase margin
• DC output resistance
• AC output resistance
• Short-circuit output current limit
Copyright © 2006–2011, Texas Instruments Incorporated
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