TIBPAL20L8-7C_15 Datasheet, PDF (21/28 Pages) Texas Instruments – HIGH-PERFORMANCE IMPACT-X

PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
TIBPAL20R4-7CFN
TIBPAL20R4-7CNT
TIBPAL20R6-10MFKB
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE
OBSOLETE
OBSOLETE
PLCC
PDIP
LCCC
FN
28
NT
24
FK
28
TBD
TBD
TBD
Lead/Ball Finish
(6)
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MSL Peak Temp Op Temp (°C)
(3)
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0 to 75
0 to 75
-55 to 125
TIBPAL20R6-10MJTB OBSOLETE CDIP
JT
24
TBD
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Call TI
-55 to 125
TIBPAL20R6-10MWB
OBSOLETE CFP
W
24
TBD
Call TI
Call TI
-55 to 125
TIBPAL20R6-7CFN
TIBPAL20R6-7CNT
OBSOLETE
OBSOLETE
PLCC
PDIP
FN
28
NT
24
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 75
0 to 75
TIBPAL20R8-10MFKB
TIBPAL20R8-10MJTB
TIBPAL20R8-10MWB
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CFP
FK
28
JT
24
W
24
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-55 to 125
-55 to 125
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
WB
5962-
87671173A
TIBPAL20
R6-10MFKB
5962-8767117LA
TIBPAL20R6-10M
JTB
5962-8767117KA
TIBPAL20R6-10M
WB
20R6-7CFN
TIBPAL20R6-7CN
T
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 2
Samples