OPA2604 Datasheet, PDF (21/26 Pages) Burr-Brown (TI) – Dual FET-Input, Low Distortion OPERATIONAL AMPLIFIER

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10.2 Layout Example
VIN A
RG
+
RF
OPA2604
SBOS006A – SEPTEMBER 2000 – REVISED DECEMBER 2015
VIN B
VOUT A
RG
+
RF
VOUT B
Place components
close to device and to
each other to reduce
parasitic errors
GND
VIN A
Output A
Output A
RF
-In A
RG
+In A
V±
(Schematic Representation)
V+
Output B
-In B
+In B
VS+
RF
RG
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible
GND
Output B
GND
VIN B
Use low-ESR,
ceramic bypass
capacitor. Place as
close to the device
as possible
GND
VS±
Ground (GND) plane on another layer
Keep input traces short
and run the input traces
as far away from
the supply lines
as possible
Figure 33. Operational Amplifier Board Layout for Noninverting Configuration
10.3 Power Dissipation
The OPA2604 is capable of driving 600-Ω loads with power supply voltages up to ±24 V. Internal power
dissipation is increased when operating at high power supply voltage. Figure 20 shows quiescent dissipation (no
signal or no load) as well as dissipation with a worst-case continuous sine wave. Continuous high-level music
signals typically produce dissipation significantly less than worst-case sine waves.
The copper leadframe construction used in the OPA2604 improves heat dissipation compared to conventional
plastic packages. To achieve best heat dissipation, solder the device directly to the circuit board and use wide
circuit board traces.
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