OPA211 Datasheet, PDF (21/37 Pages) Texas Instruments – 1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package

OPA211
OPA2211
www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009
Leadframe (Copper Alloy)
IC (Silicon)
Die Attach (Epoxy)
Mold Compound (Plastic)
Leadframe Die Pad
Exposed at Base of the Package
(Copper Alloy)
(a) Cutaway View: DDA Package (SO-8)
Mold Compound
(Plastic)
Thermal
Pad
Thermal
Pad
Die
Terminal
Leadframe
Die Attach (Epoxy)
(Copper Alloy)
Exposed at Base of Package
(b) Cutaway View: DRG Package (DFN-8)
DRG Package
(DFN-8)
(c) Bottom View
Figure 50. Views of Thermally-Enhanced SO-8 and DFN-8 Packages
DDA Package
(SO-8)
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Product Folder Link(s): OPA211 OPA2211