TPS81256_14 Datasheet, PDF (2/27 Pages) Texas Instruments – 3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP™ PACKAGING

TPS81256
SLVSAZ9A – JUNE 2012 – REVISED AUGUST 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE DEVICE OPTION
PART NUMBER
OUTPUT VOLTAGE
DEVICE
SPECIFIC FEATURES
TPS81256
TPS81257 ⁽¹⁾
5.0V
5.1V
(1) Product preview. Contact TI factory for more information
ORDERING
TPS81256SIP
TPS81257SIP
PACKAGE
MARKING
CHIP CODE
TT
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Input voltage
Input current
Power dissipation
Temperature range
ESD rating⁽⁶⁾
TPS8125x
TPS8125x
Voltage at VIN⁽²⁾, VOUT⁽²⁾, EN⁽²⁾
Continuous average current into VIN⁽³⁾
Pulsed current into VIN⁽⁴⁾
Operating temperature range, T_A ^(3)(4)(5)
Operating virtual junction, T_J
Storage temperature range, T_stg
Human Body Model - (HBM)
Charge Device Model - (CDM)
Machine Model - (MM)
UNIT
–0.3 to 6
V
1.05
A
1.3
A
Internally limited
–40 to 85
°C
–40 to 150
°C
–55 to 125
°C
2000
V
1000
V
200
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) Limit the junction and the (top side) inductor case temperature to 110°C, limit the (top side) capacitor case temperature to 85°C for
2000h operation at maximum output power. Contact TI for more details on lifetime estimation.
(4) Limit the (top side) inductor case temperature to 140°C and the (top side) capacitor temperature to 115°C for 100h operation. Contact TI
for more details on lifetime estimation.
(5) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A(max)) is dependent on the maximum operating junction temperature (T_J(max)), the
maximum power dissipation of the device in the application (P_D(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θ_JA), as given by the following equation: T_A(max)= T_J(max)–(θ_JA X P_D(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 125°C, a maximum inductor case temperature of 125°C
and a maximum capacitor case temperature of 85°C.
(6) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
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