TPS81256_14 Datasheet, PDF (1/27 Pages) Texas Instruments – 3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP™ PACKAGING

TPS81256
www.ti.com
SLVSAZ9A – JUNE 2012 – REVISED AUGUST 2013
3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP™ PACKAGING
Check for Samples: TPS81256
FEATURES
1
•2 91% Efficiency at 4MHz Operation
• Wide V_IN Range From 2.5V to 5.5V
• I_OUT ≥550mA at V_OUT = 5.0V, V_IN ≥3.3V
• ±2% Total DC Voltage Accuracy
• 43µA Supply Current
• Best-in-Class Line and Load Transient
• V_IN ≥ V_OUT Operation
• Low-Ripple Light-Load PFM Mode
• True Load Disconnect During Shutdown
• Thermal Shutdown and Overload Protection
• Sub 1-mm Profile Solution
• Total Solution Size <9mm²
• 9-Pin MicroSiP^TM Packaging
APPLICATIONS
• Cell Phones, Smart-Phones, Tablet PCs
• Mono and Stereo APA Applications
• USB-OTG, HDMI Applications
• USB Charging Port (5V)
100
90
80
70
60
50
40
.
30
20
10
0
V_{I - Input Voltage - V}
VO = 5.0 V
IO ^{- Output Current - mA}
Figure 1. Efficiency vs. Load Current
DESCRIPTION
The TPS8125x device is a complete MicroSiP™
DC/DC step-up power solution intended for battery-
powered portable applications. Included in the
package are the switching regulator, inductor and
input/output capacitors. Only a tiny additional output
capacitor is required to finish the design.
The TPS8125x is based on a high-frequency
synchronous step-up DC/DC converter optimized for
battery-powered portable applications.
The DC/DC converter operates at a regulated 4-MHz
switching frequency and enters power-save mode
operation at light load currents to maintain high
efficiency over the entire load current range.
The PFM mode extends the battery life by reducing
the supply current to 43μA (typ) during light load
operation. Intended for low-power applications, the
TPS8125x supports more than 3W output power over
a full Li-Ion battery voltage range. Input current in
shutdown mode is less than 1µA (typ), which
maximizes battery life.
The TPS8125x offers a very small solution size of
less than 9mm² due to minimum amount of external
components. The solution is packaged in a compact
(2.6mm x 2.9mm) and low profile (1.0mm) BGA
package suitable for automated assembly by
standard surface mount equipment.
V
IN
2.5 V .. 4.85 V
TPS81256SIP
L
DC/DC Converter
L
VOUT
VIN
C_I
EN
GND
V = 5.0 V
OUT
C_O
4.7µF
16V X5R (0603)
ENABLE
GND
Figure 2. Smallest Solution Size Application
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroSiP is a trademark of Texas Instruments.
2
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated