TLC59283 Datasheet, PDF (2/25 Pages) Texas Instruments – 16-Channel, Constant-Current LED Driver with Pre-Charge FET

TLC59283
SBVS199A – JUNE 2012 – REVISED JUNE 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLC59283
TLC59283
PACKAGE AND ORDERING INFORMATION⁽¹⁾
PACKAGE-LEAD
ORDERING NUMBER
TRANSPORT MEDIA, QUANTITY
SSOP-24 and QSOP-24
TLC59283DBQR
TLC59283DBQ
Tape and Reel, 2500
Tube, 50
QFN-24
TLC59283RGER
TLC59283RGE
Tape and Reel, 3000
Tape and Reel, 250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range, unless otherwise noted.
Voltage
Current
Temperature
Electrostatic discharge ratings
V_CC
V_IN
V_OUT
I_OUT
T_J(MAX)
T_stg
ESD
Supply
Input range, SIN, SCLK, LAT, BLANK, IREF
Output range, SOUT
Output range, OUT0 to OUT15
Output (dc), OUT0 to OUT15
Operating junction
Storage range
Human body model (HBM)
Charged device model (CDM)
VALUE
MIN
MAX
–0.3
+6
–0.3
–0.3
–0.3
V_CC + 0.3
V_CC + 0.3
+11
+50
+150
–55
+150
2000
2000
UNIT
V
V
V
V
mA
°C
°C
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TLC59283
DBQ
RGE
24 PINS
24 PINS
91.5
42.9
55.2
55.3
44.9
21.7
16.8
1.9
44.5
21.8
N/A
8.8
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Product Folder Link(s): TLC59283
Copyright © 2012, Texas Instruments Incorporated