TLC2872 Datasheet, PDF (2/17 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL DUAL OPERATIONAL AMPLIFIERS

TLC2872Z, TLC2872Y
Advanced LinCMOS™ RAIL-TO-RAIL
DUAL OPERATIONAL AMPLIFIERS
SLOS117 – OCTOBER 1992
description (continued)
The inputs and outputs of this device are designed to withstand 100-mA surge current without sustaining
latch-up. In addition, internal ESD-protection circuits prevent functional failures up to 2000 V. The device is
characterized for operation over the extended (Z) temperature range of – 40°C to 150°C.
TLC2872Y chip information
This chip, when properly assembled, displays characteristics similar to TLC2872Z. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(8)
(7)
67
(1)
(2)
56
VCC+
(6)
(8)
1 IN + ⁽³⁾ ₊
(1)
(2)
1OUT
1IN –
–
(7)
2OUT
+
(5)
2IN +
(6)
–
2IN –
(4)
(5)
VCC _–
(4)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ _max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(3)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
2
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