TLC2872 Datasheet, PDF (16/17 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL DUAL OPERATIONAL AMPLIFIERS

TLC2872Z, TLC2872Y
Advanced LinCMOS™ RAIL-TO-RAIL
DUAL OPERATIONAL AMPLIFIERS
SLOS117 – OCTOBER 1992
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using PSpice™ Parts™ model generation software. The Boyle
macromodel (see Note 5) and subcircuit in Figure 20 were generated using the TLC2872Z typical electrical and
operating characteristics at T_A = 25°C. Using this information, output simulations of the following key parameters
can be generated to a tolerance of 20% (in most cases):
D Maximum positive output voltage swing
D Unity gain frequency
D Maximum negative output voltage swing
D Common-mode rejection ratio
D Slew rate
D Phase margin
D Quiescent power dissipation
D DC output resistance
D Input bias current
D AC output resistance
D Open-loop voltage amplification
D Short-circuit output current limit
NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
VCC ₊
RP
2
IN –
IN+
1
3
RSS
ISS
10
DP
J1
J2
11
RD1
12
C1 _RD2
+
VC
R2
–
53
DC
99
EGND ₊
9
+
VB
–
FB
–
C2
6
GCM
GA
DIN
RO2 ₉₀
HLIM
+ _DIP
–
7
+
VLIM
–
8
91
+
VIP
–
92
–
VIN
+
VCC _–
VAD
+
–
4
60
DE
54
–+
VE
.SUBCKT TLC2872 1 2 3 4 5
C1 11 12 14E–12
C2 6 7 60.00E–12
DC 5 53 DX
DE 54 5 DX
DLP 90 91 DX
DLN 92 90 DX
DP 4 3 DX
EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5
FB 7 99 POLY (5) VB VC VE VLP VLN 0
+ 984.9E3 –1E6 1E6 1E6 –1E6
GA 6 0 11 12 377.0E–6
GCM 0 6 10 99 134E–9
ISS 3 10 DC 216.OE–6
HLIM 90 0 VLIM 1K
J1 11 2 10 JX
J2 12 1 10 JX
R2 6 9 100.OE3
RO1
5
OUT
RD1 60 11 2.653E3
RD2 60 12 2.653E3
R01 8 5 50
R02 7 99 50
RP 3 4 4.310E3
RSS 10 99 925.9E3
VAD 60 4 –.5
VB 9 0 DC 0
VC 3 53 DC .78
VE 54 4 DC .78
VLIM 7 8 DC 0
VLP 91 0 DC 1.9
VLN 0 92 DC 9.4
.MODEL DX D(IS=800.0E–18)
.MODELJXPJF(IS=1.500E–12BETA=1.316E3
+ VTO=–.270)
.ENDS
Figure 20. Boyle Macromodel and Subcircuit
PSpice and Parts are trademarks of MicroSim Corporation.
Macromodels, simulation models, or other models provided by TI,
directly or indirectly, are not warranted by TI as fully representing all
of the specification and operating characteristics of the
semiconductor product to which the model relates.
16
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