TLC2810Z Datasheet, PDF (2/23 Pages) Texas Instruments – LinCMOSE PRECISION DUAL OPERATIONAL AMPLIFIERS

TLC2810Z, TLC2810Y
LinCMOS™ PRECISION
DUAL OPERATIONAL AMPLIFIERS
SLOS120A – AUGUST 1993 – REVISED AUGUST 1994
TLC2810Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2810Z. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
(5)
(6)
59
(7)
BONDING PAD ASSIGNMENTS
(4)
(8)
72
VDD
(8)
(3)
1IN + ⁽³⁾ ₊
(2)
(1)
1OUT
1IN –
–
2IN + ⁽⁵⁾ ₊
(7)
(6)
2OUT
(2)
2IN –
–
(4)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 165°C
TOLERANCES ARE ± 10%.
(1)
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
2
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