THS7376_14 Datasheet, PDF (2/62 Pages) Texas Instruments – 4-Channel Video Amplifier with One SD and Three HD 8th-Order Filters with 6-dB Gain

THS7376
SBOS692 – JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Voltage
Continuous Output current, I_O
Continuous power dissipation
Temperature
Electrostatic discharge (ESD) ratings
(output pins)
Electrostatic discharge (ESD) ratings
(all other pins)
Supply, V_S+ to GND
Input, V_I
Maximum junction, any condition⁽²⁾, T_J
Maximum junction, continuous
operation, long-term reliability⁽³⁾, T_J
Storage range, T_stg
Human body model (HBM)
Charge device model (CDM)
Human body model (HBM)
Charge device model (CDM)
VALUE
UNIT
5.5
V
–0.4 to V_S+
V
±75
mA
See Thermal Information Table
+150
°C
+125
°C
–60 to +150
°C
±10
kV
±2
kV
±8
kV
±1
kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and lifetime of the device.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
THS7376
PW (TSSOP)
14 PINS
124.2
52.9
66.0
7.3
65.4
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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