THS4531A Datasheet, PDF (2/51 Pages) Texas Instruments – Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier

THS4531A
SLOS823A – DECEMBER 2012 – REVISED JANUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
THS4531A
CHANNEL
COUNT
1
1
1
1
1
1
PACKAGING/ORDERING INFORMATION⁽¹⁾
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
SOIC-8
T4531A
D
–40°C to +125°C
T4531A
VSSOP-8
DGK
–40°C to +125°C
531A
531A
WQFN-10
RUN
–40°C to +125°C
531A
531A
ORDERING
NUMBER
THS4531AID
THS4531AIDR
THS4531AIDGK
THS4531AIDGKR
THS4531AIRUNT
THS4531AIRUNR
TRANSPORT MEDIA,
QUANTITY
Rails, 75
Tape and reel, 2500
Rails, 80
Tape and reel, 2500
Tape and reel, 250
Tape and reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Supply voltage, V_S– to V_S+
Input/output voltage, V_IN±, V_OUT±, and V_OCM pins
Differential input voltage, V_ID
Continuous output current, I_O
Continuous input current, I_i
Continuous power dissipation
Maximum junction temperature, T_J
Operating free-air temperature range, T_A
Storage temperature range, T_stg
Electrostatic
Human body model (HBM)
discharge (ESD)
ratings:
Charge device model (CDM)
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
VALUE
5.5
(V_S–) – 0.7 to (V_S+) + 0.7
1
50
0.75
See Thermal Information
150
–40 to +125
–65 to +150
3
500
UNITS
V
V
mA
mA
°C
°C
°C
kV
V
THS4531A
SOIC
(P)
8 PINS
133
78
73
26
73
N/A
THS4531A
VSSOP
(MSOP)
(DGK)
8 PINS
198
84
120
19
118
N/A
THS4531A
WQFN
(RUN)
10 PINS
163
66
113
17
113
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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