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THS4304-SP Datasheet, PDF (2/22 Pages) Texas Instruments – RAD-TOLERANT CLASS V, WIDEBAND OPERATIONAL AMPLIFIER
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THS4304-SP
SGDS038A – SEPTEMBER 2007 – REVISED OCTOBER 2007
www.ti.com
These devices have limited built in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
U PACKAGE
TOP VIEW
10
9
8
7
VS–
5
6
NC – No internal connection
ORDERING INFORMATION(1)
PACKAGED DEVICES
5962-0721901VHA
PACKAGE TYPE(2)
Ceramic Flatpack
PACKAGE MARKINGS
0721901VHA
TRANSPORT MEDIA,
QUANTITY
Tubes, 25
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DISSIPATION RATINGS
PACKAGE
U (10)
θJC
(°C/W)
14.7
θJA
(°C/W)
189
TA ≤ 25°C
661 mW
POWER RATING(1)
TA = 85°C
344 mW
TA = 125°C
132 mW
(1) Power rating determined for a maximum junction temperature of 150°C. However, distortion starts to substantially increase above
125°C. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance
and long-term reliability.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VS Supply voltage
VI Input voltage
IO Output current
VID Differential input voltage
Continuous power dissipation
TJ Maximum junction temperature, any condition(2)
Tstg Storage temperature range
HBM
ESD Ratings CDM
MM
UNIT
+6.0 V
±VS
150 mA
±2 V
See Dissipation Rating Table
150°C
–65°C to 150°C
1600 V
1000 V
100 V
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
2
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): THS4304-SP
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