THS3110_14 Datasheet, PDF (2/38 Pages) Texas Instruments – LOW-NOISE, HIGH-VOLTAGE, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS

THS3110
THS3111
SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009........................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TOP VIEW
D, DGN
REF
V_IN−
V_IN+
V_S−
THS3110
1
8
2
7
3
6
4
5
PD
V_S+
V_OUT
NC
NC = No Internal Connection
TOP VIEW
D, DGN
NC
V_{IN −}
V_{IN +}
V_S−
THS3111
1
8
2
7
3
6
4
5
NC
V_S+
V_OUT
NC
NC = No Internal Connection
NOTE: The device with the power-down option defaults to the ON state if no signal is applied to the PD pin. Additionally, the REF pin
functional range is from V_S- to (V_S+ - 4 V).
T_A
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
AVAILABLE OPTIONS⁽¹⁾
PACKAGED DEVICE
PLASTIC SMALL OUTLINE SOIC (D)
PLASTIC MSOP (DGN) ⁽²⁾
THS3110CD
THS3110CDGN
THS3110CDR
THS3110CDGNR
THS3110ID
THS3110IDGN
THS3110IDR
THS3110IDGNR
THS3111CD
THS3111CDGN
THS3111CDR
THS3111CDGNR
THS3111ID
THS3111IDGN
THS3111IDR
THS3111IDGNR
SYMBOL
BJB
BIR
BJA
BIS
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATINGS TABLE
PACKAGE
D-8 ⁽¹⁾
DGN-8 ⁽²⁾
θ_JC (°C/W)
38.3
4.7
θ_JA (°C/W)
95
58.4
POWER RATING
T_J = +125°C
T_A = +25°C
T_A = +85°C
1.05 W
421 mW
1.71 W
685 mW
(1) These data were taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the θ_JA is 95°C/W with
power rating at T_A = +25°C of 1.05 W.
(2) These data were taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch × 3 inch (76,2 mm × 76,2 mm) PCB. For
further information, refer to the Application Information section of this data sheet.
2
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