THS3091DG4 Datasheet, PDF (2/36 Pages) Texas Instruments – HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS

THS3091
THS3095
SLOS423G – SEPTEMBER 2003 – REVISED OCTOBER 2008........................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TOP VIEW
D, DDA
NC
V_IN−
V_IN+
V_S−
THS3091
1
8
2
7
3
6
4
5
NC
V_S+
V_OUT
NC
TOP VIEW
D, DDA
REF
V_{IN −}
V_{IN +}
V_S−
THS3095
1
8
2
7
3
6
4
5
PD
V_S+
V_OUT
NC
NC = No Internal Connection
NC = No Internal Connection
See Note A.
Note A: The devices with the power−down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF
pin functional range is from V_S− to (V_S+ − 4 V).
ORDERING INFORMATION⁽¹⁾
PART NUMBER
THS3091D
THS3091DR
THS3091DDA
THS3091DDAR
Power-down
THS3095D
THS3095DR
THS3095DDA
THS3095DDAR
PACKAGE TYPE
SOIC-8
SOIC-8-PP ⁽²⁾
SOIC-8
SOIC-8-PP ⁽²⁾
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
(2) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATINGS TABLE
PACKAGE
D-8
DDA-8 ⁽³⁾
θ_JC (°C/W)
38.3
9.2
θ_JA (°C/W)⁽¹⁾
97.5
45.8
POWER RATING ⁽²⁾
T_J = 125°C
T_A = 25°C
T_A = 85°C
1.02 W
410 mW
2.18 W
873 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and
long-term reliability.
(3) The THS3091 and THS3095 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally enhanced package.
2
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