SN74AUP1G08-Q1 Datasheet, PDF (2/15 Pages) Texas Instruments – Low-Power Single 2-Input Positive-AND Gate

SN74AUP1G08-Q1
SCES847 – DECEMBER 2012
www.ti.com
DESCRIPTION
The AUP family is TI's premier solution to the low-power needs of the industry in battery-powered portable
applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal
integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
Static-Power Consumption
(µA)
Dynamic-Power Consumption
(pF)
100%
100%
80%
80%
60%
40%
3.3-V
Logic^†
60%
40%
3.3-V
L^Lo^Vg^Cic^†
20%
20%
0%
AUP
0%
† _{Single, dual, and triple gates}
AUP
Figure 1. AUP – The Lowest-Power Family
Switching Characteristics
at 25 MHz^†
3.5
3
2.5
2 ^Input
1.5
1
Output
0.5
0
−0.5
0
5
10 15 20 25 30 35 40 45
Time − ns
† _{AUP1G08 data at CL = 15 pF}
Figure 2. Excellent Signal Integrity
This single 2-input positive-AND gate performs the Boolean function: Y + A • B or Y + A ) B in positive logic.
NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it
uses the die as the package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
–40°C to 125°C
ORDERING INFORMATION⁽¹⁾
ORDERABLE PART NUMBER⁽²⁾
SN74AUP1G08QDCKRQ1
TOP-SIDE MARKING
SIT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
2
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