SMJ320C50KGDC Datasheet, PDF (2/7 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C50KGD
DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGZS007B − JUNE 1996 − REVISED JUNE 2000
description (continued)
SMJ MIL-TEMP PRODUCT FLOW
Multiprobe
25°C or hot chuck probe @ 125°C
Test conditions
Per military data sheet
DC test
Hot chuck probe @ 125°C
AC test
Hot chuck probe @ 125°C @ Speed
Visual
100x
Warranty
Data sheet upon shipment, 1 year
Certificate of Compliance Yes
Change of notification
Yes
For electrical and timing specifications, see the SMJ320C50/SMQ320C50 Digital Signal Processors data sheet
(literature number SGUS020).
SPECIFIC DIE-RELATED INFORMATION
Die Size (approximate)
358 mils × 338 mils
Die Thickness
11 mils ± 1 mil
Backside Surface Finish
SIO2
Die Backside Potential
Floating
Max Allowable Die Junction Operating Temperature 125°C
Glassivation Material and Thickness
3KAOX / 9KACN
Recommended Packing
GEL PACK
Die Attach Information
SILVER GLASS
Suggested Bond Wire Size
1.25 AL
Suggested Bonding Method
WEDGE
ESD Sensitivity
Class II
Max Allowable Process Temperature for Die Attach 450°C
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