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LP38859_14 Datasheet, PDF (2/21 Pages) Texas Instruments – 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start
LP38859
SNVS337D – JUNE 2006 – REVISED OCTOBER 2011
Connection Diagram
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SS 1
IN 2
GND 3
OUT 4
BIAS 5
TAB
IS
GND
Figure 1. 5-Lead DDPAK/TO-263, Top View
See KTT Package
SS 1
IN 2
GND 3
OUT 4
BIAS 5
TAB
IS
GND
Figure 2. 5-Lead TO-220, Top View
See NDH005D Package
Pin #
1
2
3
4
5
TAB
PIN DESCRIPTIONS
TO-220 and DDPAK/TO-263 Packages
Pin Symbol
Pin Description
SS
Soft-Start capacitor connection. Used to slow the rise time of VOUT at turn-on.
IN
The unregulated voltage input pin.
GND
Ground
OUT
The regulated output voltage pin.
BIAS
The supply for the internal control and reference circuitry.
The TAB is a thermal connection that is physically attached to the backside of the
TAB
die, and used as a thermal heat-sink connection. See the Application Information
section for details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Storage Temperature Range
Lead Temperature Soldering, 5 seconds
ESD Rating
Human Body Model(3)
Power Dissipation(4)
VIN Supply Voltage (Survival)
VBIAS Supply Voltage (Survival)
VSS SoftStart Voltage (Survival)
VOUT Voltage (Survival)
IOUT Current (Survival)
Junction Temperature
−65°C to +150°C
260°C
±2 kV
Internally Limited
−0.3V to +6.0V
−0.3V to +6.0V
−0.3V to +6.0V
−0.3V to +6.0V
Internally Limited
−40°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The
HBM rating for device pin 1 (SS) is ±1.5 kV.
(4) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
2
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