LP2992_15 Datasheet, PDF (2/35 Pages) Texas Instruments – LP2992 Micropower 250-mA Low-Noise Ultralow-Dropout Regulator in SOT-23 and WSON Packages Designed for Use with Very Low-ESR Output Capacitors

LP2992
SNVS171I – NOVEMBER 2001 – REVISED NOVEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 14
8 Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application ................................................. 15
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Examples................................................... 21
10.3 WSON Mounting ................................................... 22
11 Device and Documentation Support ................. 23
11.1 Documentation Support ........................................ 23
11.2 Community Resources.......................................... 23
11.3 Trademarks ........................................................... 23
11.4 Electrostatic Discharge Caution ............................ 23
11.5 Glossary ................................................................ 23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (January 2015) to Revision I
Page
• Added top navigator icon for TI Design ................................................................................................................................. 1
• Changed "174.2°C/W" to "169.7°C/W" in footnote 3 to Abs Max table. ................................................................................ 4
• Changed ESD Ratings table to differentiate different values for different pins/packages. .................................................... 4
• Added new footnotes 2 and 3 to Thermal Information table; update thermal values for DBV (SOT-23) package. ............... 5
• Added Power Dissipation and Estimating Junction Temperature subsections ................................................................... 18
• Added additional related document links ............................................................................................................................. 23
Changes from Revision G (March 2013) to Revision H
Page
• Added Device Information and ESD Ratings tables, Pin Configuration and Functions, Feature Description , Device
Functional Modes, Application and Implementation, Power Supply Recommendations, Layout , Device and
Documentation Support , and Mechanical, Packaging, and Orderable Information sections; update Thermal Values
and pin names ........................................................................................................................................................................ 1
Changes from Revision F (March 2013) to Revision G
Page
• Changed Changed layout of National Data Sheet to TI format ............................................................................................. 1
2
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