LMC8101 Datasheet, PDF (2/26 Pages) National Semiconductor (TI) – Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

LMC8101
SNOS496F – AUGUST 2000 – REVISED MARCH 2013
Connection Diagrams
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A2
V⁺
A1
A3
V⁺
SL
B1
OUTPUT
B3
INVERTING INPUT
Figure 1. 8-Pin VSSOP Top View
C1
N^C3ON-
SD
INVERTING
INPUT
V^-
C2
Figure 2. DSBGA Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance
V_IN differential
Output Short Circuit Duration
Supply Voltage (V⁺ − V^−)
Voltage at Input/Output pins
Current at Input Pin
Current at Output Pin⁽⁵⁾⁽⁶⁾
Current at Power Supply pins
Storage Temperature Range
Junction Temperature⁽⁷⁾
Soldering Information
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
2KV ⁽³⁾
200V ⁽⁴⁾
±Supply Voltage
See ^{(5) (6)}
12V
V⁺ +0.8V, V^− −0.8V
±10mA
±80mA
±80mA
−65°C to +150°C
+150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature at 150°C. Output currents in excess of 40mA over long term may adversely affect
reliability.
(6) Short circuit test is a momentary test. Output short circuit duration is infinite for V_S < 6V. Otherwise, extended period output short circuit
may damage the device.
(7) The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) − T_A)/θ_JA. All numbers apply for packages soldered directly onto a PC board.
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