LMC6482QML_16 Datasheet, PDF (2/29 Pages) Texas Instruments – LMC6482QML CMOS Dual Rail-To-Rail Input and Output Operational Amplifier

LMC6482QML
SNOSAR9A – DECEMBER 2010 – REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V⁺ − V^−)
Differential Input Voltage
Voltage at Input/Output Pin
Current at Input Pin⁽²⁾
Current at Output Pin⁽³⁾⁽⁴⁾
Current at Power Supply Pin
Maximum Junction Temperature (T_Jmax)⁽⁵⁾⁽³⁾
Power Dissipation⁽⁵⁾
Storage Temperature Range
Thermal Resistance⁽⁶⁾
θ_JA
θ_JC
ESD Tolerance⁽⁷⁾
8LD Ceramic DIP (Still Air)
8LD Ceramic DIP (500LF/Min Air Flow)
8LD Ceramic DIP
Lead Temp. (Soldering, 10 sec.)
16V
± Supply Voltage
(V⁺) + 0.3V, (V^−) − 0.3V
±5 mA
±30 mA
40 mA
150°C
160mW
−65°C ≤ T_A ≤ +150°C
117°C/W
62.0°C/W
16.0°C/W
260°C
1.5KV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(3) Applies to both single supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(4) Do not short circuit output to V⁺, when V⁺ is greater than 13V or reliability will be adversely affected.
(5) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (package junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax - T_A)/θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower.
(6) All numbers apply for packages soldered directly into a PC board.
(7) Human body model, 1.5 KΩ in series with 100 pF.
Recommended Operating Range⁽¹⁾
Supply Voltage
3.0V ≤ V⁺ ≤ 15.5V
Operating Temperature Range
−55°C ≤ T_A ≤ +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
1
2
3
4
5
6
7
8A
8B
9
Description
Static tests at
Static tests at
Static tests at
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Temp (°C)
+25
+125
-55
+25
+125
-55
+25
+125
-55
+25
2
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