LMC6081 Datasheet, PDF (2/21 Pages) National Semiconductor (TI) – Precision CMOS Single Operational Amplifier

LMC6081
SNOS649C – AUGUST 2000 – REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings ⁽¹⁾
Differential Input Voltage
Voltage at Input/Output Pin
Supply Voltage (V⁺ − V^−)
Output Short Circuit to V⁺
Output Short Circuit to V^−
Lead Temperature
(Soldering, 10 Sec.)
Storage Temp. Range
Junction Temperature
ESD Tolerance ⁽⁴⁾
Current at Input Pin
Current at Output Pin
Current at Power Supply Pin
Power Dissipation
±Supply Voltage
(V⁺) +0.3V,
(V^−) −0.3V
16V
(2)
(3)
260°C
−65°C to +150°C
150°C
2 kV
±10 mA
±30 mA
40 mA
(5)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) Do not connect output to V⁺, when V⁺ is greater than 13V or reliability will be adversely affected.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(4) Human body model, 1.5 kΩ in series with 100 pF.
(5) The maximum power dissipation is a function of T_J(Max), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(Max) − T_A) /θ_JA.
Operating Ratings ⁽¹⁾
Temperature Range
LMC6081AM
LMC6081AI, LMC6081I
Supply Voltage
Thermal Resistance (θ_JA), ⁽²⁾
8-Pin PDIP
8-Pin SOIC
Power Dissipation ⁽³⁾
−55°C ≤ T_J ≤ +125°C
−40°C ≤ T_J ≤ +85°C
4.5V ≤ V⁺ ≤ 15.5V
115°C/W
193°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) All numbers apply for packages soldered directly into a PC board.
(3) For operating at elevated temperatures the device must be derated based on the thermal resistance θ_JA with P_D = (T_J − T_A)/θ_JA.
2
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