LM4050QML_17 Datasheet, PDF (2/18 Pages) Texas Instruments – Precision Micropower Shunt Voltage Reference

LM4050QML
SNVS627G – JUNE 2010 – REVISED JULY 2013
Pin Number
1
2
3
4
5
6
7
8
9
10
PIN DESCRIPTIONS
Pin Name
GND/NC
GND/NC
GND/NC
GND/NC
GND
GND/NC
GND/NC
GND/NC
GND/NC
VREF
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Function
Ground or No Connect
Ground or No Connect
Ground or No Connect
Ground or No Connect
Ground
Ground or No Connect
Ground or No Connect
Ground or No Connect
Ground or No Connect
Reference Voltage
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾
Reverse Current
Forward Current
Power Dissipation (T_A = 25°C)⁽²⁾
Lead Temperature (Soldering, 10 seconds)
Storage Temperature
Package Weight (typical)
ESD Tolerance ⁽³⁾
CLGA Package
CLGA Package
CLGA Package
20 mA
10 mA
467 mW
260°C
-65°C to +150°C
241mg
Class 2 (2000V)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is PD_max = (T_Jmax − T_A)/θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower. For the
LM4050QML, T_Jmax = 125°C, and the typical thermal resistance (θ_JA), when board mounted, is 214°C/W for the 10-Lead Ceramic CLGA
package.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Operating Ratings ⁽¹⁾
Temperature Range
Reverse Current
LM4050-2.5QML
LM4050-5.0QML
-55°C ≤ T_A ≤ +125°C
60 μA to 15 mA
74 μA to 15 mA
(1) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is PD_max = (T_Jmax − T_A)/θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower. For the
LM4050QML, T_Jmax = 125°C, and the typical thermal resistance (θ_JA), when board mounted, is 214°C/W for the 10-Lead Ceramic CLGA
package.
Package Thermal Resistance
Package
θ_JA
(Still Air)
CLGA Package on 2
layer, 1oz PCB
214°C/ W
θ_JA
(500LF/Min Air flow)
147°C/ W
θ_JC
20.87°C/ W
2
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