BQ24314CDSGR Datasheet, PDF (2/22 Pages) Texas Instruments – OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li+ CHARGER FRONT-END PROTECTION IC

bq24314C
SLUSAV3 – AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE ⁽²⁾
bq24314CDSG
ORDERING INFORMATION⁽¹⁾
OVP THRESHOLD
PACKAGE
5.85 V
2mm x 2mm SON
MARKING
SDL
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
(2) To order a 3000 pcs reel add R to the part number, or to order a 250 pcs reel add T to the part
number.
PACKAGE DISSIPATION RATINGS
PART NO.
bq24314CDSG
PACKAGE
2×2 SON
R_θJC
5°C/W
R_θJA
75°C/W
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
PARAMETER
PIN
VALUE
UNIT
IN (with respect to VSS)
–0.3 to 30
V_I
Input voltage
OUT (with respect to VSS)
–0.3 to 12
V
ILIM, FAULT, CE, VBAT (with respect to VSS)
–0.3 to 7
I_I
Input current
I_O
Output current
Output sink current
IN
OUT
FAULT
2
A
2
A
15
mA
All (Human Body Model per JESD22-A114-E)
2000
V
All (Machine Model per JESD22-A115-E)
200
V
ESD
Withstand Voltage
All (Charge Device Model per JESD22-C101-C)
500
V
IN(IEC 61000-4-2) (with IN bypassed to the VSS
15 (Air Discharge)
kV
with a 1-μF low-ESR ceramic capacitor)
8 (Contact)
T_J
Junction temperature
T_stg
Storage temperature
–40 to 150
°C
–65 to 150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
bq24314C
DSG (8 PINS)
58.6
67.9
29.7
1.2
30.3
7.6
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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