TNETE2201B_14 Datasheet, PDF (17/28 Pages) Texas Instruments – 1.25-GIGABIT ETHERNET TRANSCEIVER

PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
TNETE2201BPHD
TNETE2201BPJD
TNETE2201BPJDR
TNETE2201BPJDRG4
TNETE2201BPJW
TNETE2201BPJWG4
TNETE2201BPJWR
TNETE2201BPJWRG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE HTQFP
PHD 64
90 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJD 64 160 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJD 64 1000 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJD 64 1000 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJW 64 160 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJW 64 160 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJW 64 1000 Green (RoHS
& no Sb/Br)
ACTIVE HTQFP
PJW 64 1000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TNETE2201B
TNETE2201B
TNETE2201B
TNETE2201B
TNETE2201B
TNETE2201B
TNETE2201B
TNETE2201B
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1