ADS7800KUE4 Datasheet, PDF (17/20 Pages) Texas Instruments – 12-Bit 3μs Sampling ANALOG-TO-DIGITAL CONVERTER

JDN (R–CDIP–T24)
MECHANICAL DATA
MCDI046 – JANUARY 2002
CERAMIC SIDE-BRAZE DUAL-IN-LINE
24
Index
Area
1
1.212 (30,78)
1.188 (30,18)
13
0.310 (7,87)
0.280 (7,11)
12
Base
Plane
Seating
Plane
0.065 (1,65)
0.030 (0,76)
0.100 (2,54)
TYP
0.060 (1,52) _E
0.038 (0,97)
0.021 (0,53)
E
0.015 (0,38)
0.010 (0,25)
MIN
0.175 (4,45)
0.105 (2,67)
0.325 (8,26)
0.290 (7,37)
0.055 (1,40)
E _{0.025 (0,64)}
0.175 (4,45)
0.125 (3,18)
D
0°– 15°
0.012 (0,30)
0.008 (0,20)
0.300 (7,62)
TYP
4204038/A 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Leads within 0.005 (0.13) radius of true position (TP) at gage plane with maximum material condition and unit installed.
D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected ground leads.
E. Outlines on which the seating plane is coincident with the plane (standoff = 0), terminal lead standoffs are not required, and lead
shoulder may equal lead width along any part of the lead above the seating/base plane.
F. A visual index feature must be located within the cross-hatched area.
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