AM3359_14 Datasheet, PDF (162/236 Pages) Texas Instruments – Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)

AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717F – OCTOBER 2011 – REVISED APRIL 2013
www.ti.com
Complete stackup specifications are provided in Table 5-46.
Table 5-46. PCB Stackup Specifications⁽¹⁾
NO.
PARAMETER
MIN
TYP
MAX UNIT
1 PCB routing and plane layers
4
2 Signal routing layers
2
3 Full ground layers under DDR2 routing region
1
4 Number of ground plane cuts allowed within DDR2 routing region
0
5 Full VDDS_DDR power reference layers under DDR2 routing region
1
6 Number of layers between DDR2 routing layer and reference ground plane
0
7 PCB routing feature size
4
mils
8 PCB trace width, w
9 PCB BGA escape via pad size⁽²⁾
10 PCB BGA escape via hole size⁽²⁾
4
mils
18
20 mils
10
mils
11 AM335x BGA pad size
13 Single-ended impedance, Zo⁽³⁾
14 Impedance control⁽⁴⁾⁽⁵⁾
ZCZ package
ZCE package
50
Zo-5
0.5
mm
0.4
75 ohms
Zo
Zo+5 ohms
(1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the
AM335x device.
(3) Zo is the nominal singled-ended impedance selected for the PCB.
(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(5) Tighter impedance control is required to ensure flight time skew is minimal.
162 Peripheral Information and Timings
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