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AM3359_14 Datasheet, PDF (112/236 Pages) Texas Instruments – Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)
AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
SPRS717F – OCTOBER 2011 – REVISED APRIL 2013
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4.2.2.4 OSC1 LVCMOS Digital Clock Source
Figure 4-14 shows the recommended oscillator connections when OSC1 of the ZCE package is connected
to an LVCMOS square-wave digital clock source and Figure 4-15 shows the recommended oscillator
connections when OSC1 of the ZCZ package is connected to an LVCMOS square-wave digital clock
source. The LVCMOS clock source is connected to the RTC_XTALIN terminal. In this mode of operation,
the RTC_XTALOUT terminal should not be used to source any external components. The printed circuit
board design should provide a mechanism to disconnect the RTC_XTALOUT terminal from any external
components or signal traces that may couple noise into OSC1 via the RTC_XTALOUT terminal.
The RTC_XTALIN terminal has a 10 - 40 kΩ internal pull-up resistor which is enabled when OSC1 is
disabled. This internal resistor prevents the RTC_XTALIN terminal from floating to an invalid logic level
which may increase leakage current through the oscillator input buffer.
VDDS_RTC
RTC_XTALIN
AM335x
(ZCE Package)
RTC_XTALOUT
LVCMOS
Digital
N/C
Clock
Source
Figure 4-14. OSC1 (ZCE Package) LVCMOS Circuit Schematic
VDDS_RTC
RTC_XTALIN
AM335x
(ZCZ Package)
VSS_RTC RTC_XTALOUT
LVCMOS
Digital
N/C
Clock
Source
Figure 4-15. OSC1 (ZCZ Package) LVCMOS Circuit Schematic
Table 4-7. OSC1 LVCMOS Reference Clock Requirements
NAME
DESCRIPTION
MIN
TYP
MAX UNIT
f(RTC_XTALIN)
Frequency, LVCMOS reference clock
Frequency, LVCMOS reference clock
stability and tolerance(1)
Maximum RTC error =
10.512 minutes/year
32.768
-20
MHz
20 ppm
Maximum RTC error = 26.28
-50
minutes/year
50 ppm
tdc(RTC_XTALIN)
tjpp(RTC_XTALIN)
tR(RTC_XTALIN)
tF(RTC_XTALIN)
Duty cycle, LVCMOS reference clock period
Jitter peak-to-peak, LVCMOS reference clock period
Time, LVCMOS reference clock rise
Time, LVCMOS reference clock fall
45
55 %
-1
1%
5 ns
5 ns
(1) Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement.
112 Power and Clocking
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