ISO3086T_15 Datasheet, PDF (16/31 Pages) Texas Instruments – Isolated 5-V RS-485 Transceiver With Integrated Transformer Driver

ISO3086T
SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015
8.3.1.3 Regulatory Information
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VDE
CSA
Certified according to DIN V VDE V 0884-
10(VDE V 0884-10):2006-12 and DIN EN
61010-1 (VDE 0411-1)
Approved according to CSA Component
Acceptance Notice 5A, IEC 60959-1 and IEC
61010-1
Basic Insulation
3000 V_RMS Isolation Rating;
Maximum Transient Isolation Voltage, 4242 V_PK Reinforced insulation per CSA 61010-1-04 and
Maximum Surge Isolation Voltage, 3077 V_PK IEC 61010-1 2nd Ed. 150 V_RMS working voltage;
Maximum Working Isolation Voltage, 566 V_PK Basic insulation per CSA 61010-1-04 and IEC
61010-1 2nd Ed. 600 V_RMS working voltage;
Basic insulation per CSA 60950-1-07 and IEC
60950-1 2nd Ed. 760 V_RMS working voltage
Certificate Number: 40016131
Master Contract Number: 220991
UL
Approved under UL 1577 Component
Recognition Program
Single Protection, 2500 V_RMS(1)
File Number: E181974
(1) Production tested ≥ 3000 V_RMS for 1 second in accordance with UL 1577.
8.3.1.4 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply. Without current limiting, sufficient power is
dissipated to overheat the die and damage the isolation barrier—potentially leading to secondary system failures.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
I_S Safety input, output, or supply current _DW-16 θ_JA = 80.5°C/W, V_I = 5.5 V, T_J = 170°C, T_A = 25°C
T_S Maximum safety temperature
327 mA
150 °C
The safety-limiting constraint is the maximum junction temperature specified for the device. The power
dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines
the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is
that of a device installed on a High-K Test Board for Leaded Surface Mount Packages. The power is the
recommended maximum input voltage times the current. The junction temperature is then the ambient
temperature plus the power times the junction-to-air thermal resistance.
350
V_CC1 = V_CC2 = 5.5 V
300
250
200
150
100
50
0
0
50
100
150
200
Temperature - °C
Figure 30. Thermal Derating Curve per VDE
16
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