DRV8837_15 Datasheet, PDF (16/24 Pages) Texas Instruments – Low-Voltage H-Bridge Driver

DRV8837, DRV8838
SLVSBA4D – JUNE 2012 – REVISED DECEMBER 2015
11 Device and Documentation Support
www.ti.com
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• Calculating Motor Driver Power Dissipation, SLVA504
• DRV8837EVM User’s Guide, SLVU749
• DRV8838EVM User’s Guide, SLVUA43
• Independent Half-Bridge Drive with DRV8837, SLVA539
• Understanding Motor Driver Current Ratings, SLVA505
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
PARTS
DRV8837
DRV8838
PRODUCT FOLDER
Click here
Click here
Table 6. Related Links
SAMPLE & BUY
Click here
Click here
TECHNICAL
DOCUMENTS
Click here
Click here
TOOLS &
SOFTWARE
Click here
Click here
SUPPORT &
COMMUNITY
Click here
Click here
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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Product Folder Links: DRV8837 DRV8838