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| DRV8837_15 Datasheet, PDF (15/24 Pages) Texas Instruments – Low-Voltage H-Bridge Driver | |||
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www.ti.com
10 Layout
DRV8837, DRV8838
SLVSBA4D â JUNE 2012 â REVISED DECEMBER 2015
10.1 Layout Guidelines
The VM and VCC pins should be bypassed to GND using low-ESR ceramic bypass capacitors with a
recommended value of 0.1 µF rated for VM and VCC. These capacitors should be placed as close to the VM and
VCC pins as possible with a thick trace or ground plane connection to the device GND pin.
10.2 Layout Example
0.1 µF
0.1 µF
VM
OUT1
OUT2
GND
VCC
nSLEEP
IN1/PH
IN2/EN
Figure 16. Simplified Layout Example
10.3 Power Dissipation
Power dissipation in the DRV883x family of devices is dominated by the power dissipated in the output FET
resistance, or rDS(on). Use Equation 1 to estimate the average power dissipation when running a stepper motor.
PTOT = r DS(on) ´ (IOUT(RMS) )2
where
⢠PTOT is the total power dissipation
⢠rDS(on) is the resistance of the HS plus LS FETs
⢠IOUT(RMS) is the rms or dc output current being supplied to the load
(1)
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and
heatsinking.
NOTE
The value of rDS(on) increases with temperature, so as the device heats, the power
dissipation increases.
The DRV883x family of devices has thermal shutdown protection. If the die temperature exceeds approximately
150°C, the device is disabled until the temperature drops to a safe level.
Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation,
insufficient heatsinking, or too high an ambient temperature.
Copyright © 2012â2015, Texas Instruments Incorporated
Product Folder Links: DRV8837 DRV8838
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