TMS570LS3137_12 Datasheet, PDF (155/159 Pages) Texas Instruments – TMS570LS3137 16/32-Bit RISC Flash Microcontroller

TMS570LS3137
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6 Mechanical Data
SPNS162. – SEPTEMBER 2011
6.1 Thermal Data
Table 6-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 6-2 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 6-1. Thermal Resistance Characteristics
(PGE Package)
PARAMETER
RΘ_JA
RΘ_JC
°C / W
45
5
Table 6-2. Thermal Resistance Characteristics
(ZWT Package)
PARAMETER
RΘ_JA
RΘ_JC
°C / W
18.8
7.1
6.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2011, Texas Instruments Incorporated
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