TLE2425CLP Datasheet, PDF (14/22 Pages) Texas Instruments – PRECISION VIRTUAL GROUND

PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
TLE2425ILPE3
TLE2425MD
TLE2425MDG4
TLE2425MDR
TLE2425MDRG4
TLE2425MFKB
TLE2425MJG
TLE2425MJGB
TLE2425MLP
Status Package Type Package Pins Package Qty
(1)
Drawing
Eco Plan Lead/Ball Finish MSL Peak Temp
(2)
(3)
Op Temp (°C) Top-Side Markings
(4)
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2425I
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 2425M
& no Sb/Br)
ACTIVE
SOIC
D
8
75
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 2425M
& no Sb/Br)
OBSOLETE SOIC
D
8
TBD
Call TI
Call TI
-55 to 125 2425M
ACTIVE
SOIC
D
8
2500
Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 2425M
& no Sb/Br)
OBSOLETE LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
OBSOLETE CDIP
JG
8
TBD
Call TI
Call TI
-55 to 125
OBSOLETE CDIP
JG
8
TBD
Call TI
Call TI
-55 to 125
OBSOLETE TO-92
LP
3
TBD
Call TI
Call TI
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Only one of markings shown within the brackets will appear on the physical device.}
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2