CD54HC221_15 Datasheet, PDF (12/23 Pages) Texas Instruments – High-Speed CMOS Logic

PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
CD74HC221PWT
CD74HCT221E
CD74HCT221EE4
CD74HCT221M
CD74HCT221M96
CD74HCT221M96E4
CD74HCT221M96G4
CD74HCT221MG4
CD74HCT221MT
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE TSSOP
PW 16 250 Green (RoHS
& no Sb/Br)
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
ACTIVE
SOIC
D
16
40 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
16
40 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
D
16 250 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
HJ221
CD74HCT221E
CD74HCT221E
HCT221M
HCT221M
HCT221M
HCT221M
HCT221M
HCT221M
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 2