CD54HC221_15 Datasheet, PDF (11/23 Pages) Texas Instruments – High-Speed CMOS Logic

PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
5962-8780501EA
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
CDIP
J
16
1
Eco Plan
(2)
TBD
CD54HC221F
CD54HC221F3A
ACTIVE
ACTIVE
CDIP
CDIP
J
16
1
J
16
1
TBD
TBD
CD74HC221-W
CD74HC221E
CD74HC221EE4
CD74HC221M
CD74HC221M96
CD74HC221M96E4
CD74HC221MG4
CD74HC221MT
CD74HC221NSR
CD74HC221PW
CD74HC221PWG4
CD74HC221PWR
CD74HC221PWRE4
CD74HC221PWRG4
ACTIVE WAFERSALE YS
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SO
NS
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
0
TBD
16
25
Pb-Free
(RoHS)
16
25
Pb-Free
(RoHS)
16
40 Green (RoHS
& no Sb/Br)
16 2500 Green (RoHS
& no Sb/Br)
16 2500 Green (RoHS
& no Sb/Br)
16
40 Green (RoHS
& no Sb/Br)
16 250 Green (RoHS
& no Sb/Br)
16 2000 Green (RoHS
& no Sb/Br)
16
90 Green (RoHS
& no Sb/Br)
16
90 Green (RoHS
& no Sb/Br)
16 2000 Green (RoHS
& no Sb/Br)
16 2000 Green (RoHS
& no Sb/Br)
16 2000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
A42
A42
A42
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
Call TI
N / A for Pkg Type
-55 to 125
N / A for Pkg Type -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Device Marking
(4/5)
5962-8780501EA
CD54HC221F3A
CD54HC221F
5962-8780501EA
CD54HC221F3A
CD74HC221E
CD74HC221E
HC221M
HC221M
HC221M
HC221M
HC221M
HC221M
HJ221
HJ221
HJ221
HJ221
HJ221
Samples
Addendum-Page 1