TM4C1231H6PZ Datasheet, PDF (1125/1174 Pages) Texas Instruments – Tiva Microcontroller

Tiva^™ TM4C1231H6PZ Microcontroller
21.2
Operating Characteristics
Table 21-3. Temperature Characteristics
Characteristic
Ambient operating temperature range
Case operating temperature range
Junction operating temperature range
Symbol Value
T_A
-40 to +85
T_C
-40 to +93
T_J
-40 to +95
Unit
°C
°C
°C
Table 21-4. Thermal Characteristics^a
Characteristic
Symbol Value
Thermal resistance (junction to ambient)^b Θ_JA
Thermal resistance (junction to board)^b Θ_JB
Thermal resistance (junction to case)^b Θ_JC
48.8
26.5
8.9
Thermal metric (junction to top of
package)
Ψ_JT
0.2
Unit
°C/W
°C/W
°C/W
°C/W
Thermal metric (junction to board)
Ψ_JB
26.1
°C/W
Junction temperature formula
T_J
T_C + (P • Ψ_JT)
°C
T_PCB + (P • Ψ_JB)^c
T_A + (P • Θ_JA)^d
T_B + (P • Θ_JB)^ef
a. For more details about thermal metrics and definitions, see the Semiconductor and IC Package Thermal Metrics Application
Report (literature number SPRA953).
b. Junction to ambient thermal resistance (Θ_JA), junction to board thermal resistance (Θ_JB), and junction to case thermal
resistance (Θ_JC) numbers are determined by a package simulator.
c. T_PCB is the temperature of the board acquired by following the steps listed in the EAI/JESD 51-8 standard summarized in
the Semiconductor and IC Package Thermal Metrics Application Report (literature number SPRA953).
d. Because Θ_JA is highly variable and based on factors such as board design, chip/pad size, altitude, and external ambient
temperature, it is recommended that equations containing Ψ_JT and Ψ_JB be used for best results.
e. T_B is temperature of the board.
f. Θ_JB is not a pure reflection of the internal resistance of the package because it includes the resistance of the testing board
and environment. It is recommended that equations containing Ψ_JT and Ψ_JB be used for best results.
June 12, 2014
Texas Instruments-Production Data
1125