TPS65381A-Q1_17 Datasheet, PDF (112/120 Pages) Texas Instruments – Multirail Power Supply for Microcontrollers in Safety-Relevant Applications

TPS65381A-Q1
SLVSDJ1A – JULY 2016 – REVISED MAY 2017
www.ti.com
NOTE
The PowerPAD thermal pad is not directly connected to any leads of the package. However,
it is electrically and thermally connected to the substrate, which is the ground (GND) and
power ground (PGND) of the device.
NOTE
Additional information about thermal analysis and design can be found on www.ti.com in the
WEBENCH® Design Center thermal analysis section.
9 Device and Documentation Support
9.1 Documentation Support
9.1.1 Related Documentation
For related documentation, see the following:
• Device Behavior Under Slow VBAT Ramp-Up and Ramp-Down
• DPI Evaluation TPS65381-Q1
• Efficiency Evaluation TPS65381-Q1
• Safety Manual for TPS65381-Q1 and TPS65381A-Q1 Multirail Power Supply
• TPS65381EVM User's Guide
• TPS65381-Q1 and TPS65381A-Q1 Design Checklist
• TPS65381-Q1 and TPS65381A-Q1 Power Estimator
9.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
9.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools
and contact information for technical support.
9.4 Trademarks
Hercules, C2000, PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
9.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
112 Device and Documentation Support
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Product Folder Links: TPS65381A-Q1