LP3882EMR-12 Datasheet, PDF (11/19 Pages) Texas Instruments – LP3882 1.5A Fast-Response Ultra Low Dropout Linear Regulators

LP3882
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SNVS226F – MARCH 2003 – REVISED APRIL 2013
HEATSINKING PSOP PACKAGE
Heatsinking for the SO PowerPad package is accomplished by allowing heat to flow through the ground slug on
the bottom of the package into the copper on the PC board. The heat slug must be soldered down to a copper
plane to get good heat transfer. It can also be connected through vias to internal copper planes. Since the heat
slug is at ground potential, traces must not be routed under it which are not at ground potential. Under all
possible conditions, the junction temperature must be within the range specified under operating conditions.
Figure 23 shows a curve for the θ_JA of the PSOP package for different copper area sizes using a typical PCB
with one ounce copper in still air.
180
130
80
30
0
0.5
1
1.5
COPPER AREA (sq. in.)
Figure 23. θ_JA vs. Copper (1 ounce) Area for PSOP Package
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