TPS68470 Datasheet, PDF (102/105 Pages) Texas Instruments – Power Management Unit with LED Flash Driver and Reference Clock Generation for Compact Camera Module (CCM) Applications

YFF0056
B
BUMP A1
CORNER
SCALE 4.200
E
PACKAGE OUTLINE
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
A
D
0.625 MAX
0.30
0.12
BALL TYP
2.4 TYP
SYMM
C
SEATING PLANE
0.05 C
H
G
F
E
2.8
TYP
D
SYMM
D: Max = 3.344 mm, Min =3.284 mm
E: Max = 2.948 mm, Min =2.888 mm
0.4 TYP
C
B
A
12
3 456 7
56X
0.3
0.2
0.015 C A B
NOTES:
0.4 TYP
4219481/A 10/2014
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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