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TMS320_13 Datasheet, PDF (1/70 Pages) Texas Instruments – TMS320 SECOND GENERATION DIGITAL SIGNAL PROCESSORS
TMS320 SECOND GENERATION
DIGITAL SIGNAL PROCESSORS
 80-ns Instruction Cycle Time
 544 Words of On-Chip Data RAM
 4K Words of On-Chip Secure Program
EPROM (TMS320E25)
 4K Words of On-Chip Program ROM
(TMS320C25)
 128K Words of Data/Program Space
 32-Bit ALU/Accumulator
 16  16-Bit Multiplier With a 32-Bit Product
 Block Moves for Data/Program
Management
 Repeat Instructions for Efficient Use of
Program Space
 Serial Port for Direct Codec Interface
 Synchronization Input for Synchronous
Multiprocessor Configurations
 Wait States for Communication to Slow
Off-Chip Memories/Peripherals
 On-Chip Timer for Control Operations
 Single 5-V Supply
 Packaging: 68-Pin PGA, PLCC, and
CER-QUAD
 68-to-28 Pin Conversion Adapter Socket for
EPROM Programming
 Commercial and Military Versions Available
 NMOS Technology:
— TMS32020 . . . . . . . . . 200-ns cycle time
 CMOS Technology:
— TMS320C25 . . . . . . . . 100-ns cycle time
— TMS320E25 . . . . . . . . 100-ns cycle time
— TMS320C25-50 . . . . . . 80-ns cycle time
SPRS010B — MAY 1987 — REVISED NOVEMBER 1990
68-Pin GB Package†
(Top View)
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
J
K
L
68-Pin FN and FZ Packages†
(Top View)
VSS
D7
D6
D5
D4
D3
D2
D1
D0
SYNC
INT0
INT1
INT2
VCC
DR
FSR
A0
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
10
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
IACK
MSC
CLKOUT1
CLKOUT2
XF
HOLDA
DX
FSX
X2 CLKIN
X1
BR
STRB
R/W
PS
IS
DS
VSS
description
This data sheet provides complete design documentation for the second-generation devices of the TMS320
family. This facilitates the selection of the devices best suited for user applications by providing all specifications
and special features for each TMS320 member. This data sheet is divided into four major sections: architecture,
electrical specifications (NMOS and CMOS), timing diagrams, and mechanical data. In each of these sections,
generic information is presented first, followed by specific device information. An index is provided for quick
reference to specific information about a device.
ADVANCE INFORMATION concerns new products in the
sampling or preproduction phase of development.
Characteristic data and other specifications are subject to
change without notice.
Copyright  1991, Texas Instruments Incorporated
 POST OFFICE BOX 1443
HOUSTON, TEXAS 77001
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