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SN74LVC2G125_16 Datasheet, PDF (1/22 Pages) Texas Instruments – Dual Bus Buffer Gate With 3-State Outputs
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SN74LVC2G125
SCES204P – APRIL 1999 – REVISED JANUARY 2016
SN74LVC2G125 Dual Bus Buffer Gate With 3-State Outputs
1 Features
•1 Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.3 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate
Inputs From a Max of 5.5 V Down
to the VCC Level
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 200-V Machine Model
– 1000-V Charged-Device Model
2 Applications
• Cable Modem Termination Systems
• High-Speed Data Acquisition and Generation
• Military: Radars and Sonars
• Motor Controls: High-Voltage
• Power Line Communication Modems
• SSDs: Internal or External
• Video Broadcasting and Infrastructure: Scalable
Platforms
• Video Broadcasting: IP-Based Multi-Format
Transcoders
• Video Communications Systems
3 Description
The SN74LVC2G125 device is a dual bus buffer
gate, designed for 1.65-V to 5.5-V VCC operation.
This device features dual line drivers with 3-state
outputs. The outputs are disabled when the
associated output-enable (OE) input is high.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
To ensure the high-impedance state during power up
or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE
SM8 (8)
2.95 mm × 2.80 mm
SN74LVC2G125
US8 (8)
2.30 mm × 2.00 mm
DSBGA (8)
1.91 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
1OE
1A
1Y
2OE
2A
2Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.