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SN74LV74A-Q1_15 Datasheet, PDF (1/15 Pages) Texas Instruments – DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SN74LV74A-Q1
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
D Qualified for Automotive Applications
D 2-V to 5.5-V VCC Operation
D Max tpd of 13 ns at 5 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
D Support Mixed-Mode Voltage Operation on
All Ports
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SCLS556B − DECEMBER 2003 − REVISED APRIL 2008
D OR PW PACKAGE
(TOP VIEW)
1CLR 1
1D 2
1CLK 3
1PRE 4
1Q 5
1Q 6
GND 7
14 VCC
13 2CLR
12 2D
11 2CLK
10 2PRE
9 2Q
8 2Q
description/ordering informationS
This dual positive-edge-triggered D-type flip-flop is designed for 2-V to 5.5-V VCC operation.
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) inputs meeting the setup-time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION{
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − D
−40°C to 125°C
TSSOP − PW
Tape and reel SN74LV74AQDRQ1
Tape and reel SN74LV74AQPWRQ1
LV74A
LV74A
† For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2008, Texas Instruments Incorporated
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